吳翔，男，1990年4月出生，博士研究生。2020年6月畢業于中南大學材料科學與工程專業，獲工學博士學位。2020年8月入職長沙理工大學材料科學與工程學院。

主要研究方向：

（1）高強高導耐熱銅合金的組織性能表征及其相關機理研究

（2）高性能金屬基復合材料的設計與應用

（3）快速凝固技術的研究與應用

參與的科研項目：

國家自然科學基金青年科學基金項目（5180041060），快速凝固高硅鋁電子封裝材料的稀土元素微合金化及強韌化機理研究，2019-2021，參研

近五年發表SCI期刊論文：

[1]X. Wu,R. Wang, C. Peng, Y. Feng, Z. Cai*, Effects of annealing on microstructure and mechanical properties of rapidly solidified Cu-3?wt% Ag-1?wt% Zr,Materials Science and Engineering: A, 2019, 739: 357-366.

[2] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Influence of hot isostatic pressing and forging on the microstructure and mechanical properties of Cu-3Ag-1Zr alloys, Materials & Design, 2019, 168: 107676.

[3] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Microstructures and elevated temperature properties of rapidly solidified Cu-3Ag-0.5Zr and Cu-3Ag-0.5Zr-0.4Cr-0.35Nb alloys, Journal of Alloys and Compounds. 2019, 803: 1037-1044.

[4] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Effects of cold rolling and low-temperature annealing on microstructure and mechanical properties of rapidly solidified Cu-3Ag-0.5Zr alloy,Materials Science and Engineering: A, 2020, 773: 138829.

[5]X. Wu, R. Wang, C. Peng, G. Jiang*, Microstructure stability and tensile properties of Cu-3Ag-1Zr alloy fabricated by rapid solidification and cold rolling, Materials Characterization. 2020, 160: 110091.

[6] X. Wu, R. Wang, C. Peng, J. Zeng*, Ultrafine grained Cu-3Ag-xZr (x = 0.5, 1.0 wt%) alloys with high strength and good ductility fabricated through rapid solidification and cryorolling,Materials Science and Engineering: A, 2020, 778: 139095.

[7] X. Wu, R. Wang, C. Peng, X. Wang*, Low-temperature annealing behavior and tensile properties of the rapidly solidified Cu3Ag0.5Zr0.4Cr0.35Nb alloy reinforced by cold rolling, Journal of Alloys and Compounds,2020, 828: 154371.

[8] S. Yu, R. Wang, C. Peng, Z. Cai*, X. Wu, Y. Feng, X. Wang, Effect of minor scandium addition on the microstructure and properties of Al-50Si alloys for electronic packaging, Journal of Materials Science: Materials in Electronics, 2019, 30: 20770-20777.

[9] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, H. Li, High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging,Materials Science and Engineering: A, 2018, 728: 95-101.

[10] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, H. Li, Microstructure, mechanical and thermo-physical properties of Al-50Si-xMg alloys, Materials Science and Engineering: A, 2018, 730: 57-65.

[11] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, Effect of copper content on microstructure and mechanical properties of Al/Sip composites consolidated by liquid phase hot pressing, Materials & Design, 2016, 170: 10-17.

[12] Z. Cai, C. Zhang*,R. Wang, C. Peng, X. Wu, H. Li*, M. Yang. Improvement of deformation capacity ofgas-atomized hypereutectic Al-Si alloy powder by annealing treatment, Transactions of Nonferrous Metals Society of China,2018,28(08):1475-1483.

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